Forwarding for Benoit Nadeau
____________________Reply Separator____________________
Subject: Heat sink temperature rise
Author: Benoit Nadeau <[email protected]>
List-Post: [email protected]
Date: 5/12/00 12:55 PM
Bonjour de Montréal,
Usually, I am more on the EMC side, but I had a question yesterday
regarding IEC 950 that I would like to get your advices on:
In IEC 60950:, is a metal heat sink, glued on a IC which is soldered on a
PC type add-on card installed into a Personal computer chassis should be
considered as a "PART in OPERATOR ACCESS AREA" or should it be considered
as a component?
In particular I would be interested to know what should be the Maximum
Temperature-rise limits of this heat sink according to 60950 section 5.1
"Heating".
Your comments will be very much appreciated.
Regards,
----------------------------------------------
Benoît Nadeau, ing. M.ing (P.eng., M.eng.)
Conformity Group Manager
Matrox
Tel: (514) 822-6000 (x2475)
Fax: (514) 822-6275
Chairman
2001 IEEE EMC International Symposium on
Electromagnetic Compatibility
Montreal August 13 to 17, 2001
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