Hello Jim and Mihai,
According to IEC 60950 3rd. edition, Clause 2.10.5.3, the distance between
two adjacent tracks on the same inner layer of a printed circuit board is
treated as distance through insulation, and therefore 0,4 mm apply for
supplementary or reinforced insulation.
Your question regarding air bubbles or other defects is should be covered
by the applied electric strength test.
mit freundlichen Gruessen/ best regards
Volker Gasse
IBM Germany, Technical Relations/Product Safety,
Tel: +49-7031-642-6796, Fax: -6916, e-mail: [email protected]
Mail: D3114/7103-91, D-70548 Stuttgart, Germany
[email protected] (Jim Bacher) on 17.03.2000 13:50:53
Please respond to [email protected] (Jim Bacher)
To: [email protected]
cc: [email protected] (bcc: Volker Gasse/Germany/IBM)
Subject: Fwd:Isolations on inner layers
forwarding for [email protected] ... Jim
____________________Forward Header_____________________
Subject: Isolations on inner layers
Author: Mihai Vintila <[email protected]>
List-Post: [email protected]
Date: 3/16/00 7:34 PM
Hello,
I have a question concerning isolations for hazardous voltages on
inner
layers of a multilayer PCB.
The material is standard FR4.
I have read the EN60950 spec and it seems like for copper on
different
inner layers an isolation of 0.4mm would be good enough. Now what I could
not
figure is about traces on the same inner layer. In this case an isolation
of 0.4
mm is as good as it is between different layers, or should I take into
consideration the manufacturing errors (impurities, air bubbles, a.s.o.)
and
make a bigger isolation, but how much bigger?
The voltages I am working with are some of them TNV1 and others
220VAC
(mains).
Many thanks,
Mihai
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