Dear all,
Are you working with a MLB, if so how many layers and what is your stack
assignment?  I think if you are looking for a rule of thumb on layout
density, you can end up literally barking up the wrong tree.

I believe the correct rule of thumb is not to let a critical trace/track
cross any of the ground/power layer.  This Swiss cheese phenomena (presence
of holes and gaps in the ground/power plane) result in large loop areas for
the return current ( inductance) because the ground (return current
'image') plane was full of obstructions and obstacles.  I assume that you
are working with a 4 layer board, you could try to place the 'signal layer'
over the ' ground /power' planes and see if the critical tracks/traces does
cross any ground gaps.  First check if the ground and power plane are all
gapped in the same places.
:-)
best regards

Tim Foo


                                                                                
                                                           
                      Ken Javor                                                 
                                                           
                      <ken.javor@emccomplian         To:      
[email protected]                                                  
                      ce.com>                        cc:      (bcc: Wan Juang 
Foo/ece/staff/npnet)                                         
                      Sent by:                       Subject: PCB layout 
question for good EMC performance                                 
                      owner-emc-pstc@majordo                                    
                                                           
                      mo.ieee.org                                               
                                                           
                                                                                
                                                           
                                                                                
                                                           
                      06/08/02 04:19 AM                                         
                                                           
                      Please respond to Ken                                     
                                                           
                      Javor                                                     
                                                           
                                                                                
                                                           
                                                                                
                                                           





I have a problem where a very large number of chips are mounted on a very
small board.  The ground plane looks like Swiss cheese and there is ground
bounce accordingly.  For future reference, is there a rule-of-thumb for how
much PCB area should be allocated per number of IC chips/pins so as to be
able to provide ground returns for all important signal/clock routing?
<snip>








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