Something's bothering me about this discussion. 
It's not what people have said that I disagree. 
Maybe it's to be put in the FWIW department, 

1MV breaks down 1 meter of air @ STP. 
It then follows that 1KV breaks down 1 mm of air. 

So, that's 1mm AIR/1KV. 

FR4 has a dielectric factor of about 4.7.  That simply 
means it's 4.7 times stronger than air.  Therefore, 
*in theory* 1KV should in theory break down  
(1/4.7) mm of FR4, or  0.21 mm of FR4. 

So, that's 0.21mm FR4/1KV. 

Now the circuit you're working with, primary or TNV, ... 
will decide the highest amount of stress during test. 

If it's going to be 2KVDC, then it's 0.4 mm.  
If it's going to be 3KVDC, 0.6mm. 
If it's going to be 8KV with some ESD test, then it's 1.6mm. 
That's between layers. 

Wanna put a safety factor of x2 in? 
The 2KV changes to 0.8mm. 
The 3KV changes to 1.2mm. 
Etc ... 

Something to consider. 

That's strictly between layers. 

I'd personally use the air breakdown rule of 
1mm/1KV for planes in proximity to vias.  

And I would always work this out by myself 
before looking up the standard. 

And *ALWAYS*, check the standard. 

Regards, Doug McKean 



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