Thanks for the quick response.  Please let me explore this further.  I have
used the "special case" as the general case where the EUT has many signal
lines in which it would be too costly and impractical to have a CDN on each
line.  The special case allows the test engineer the flexibility of
disregarding the multiple impedances by way of the method described in the
body of the document and amplified in Annex A.  I will admit I somehow
missed the point about the lower impedance requirement of the AE.  In the
case where a CDN is installed on each line from the EUT, how are the signal
line shields handled at the EUT - left unterminated, terminated to ground,
or terminated to the metallic case?  EN61000-6-2 is the generic immunity
standard we use.  It states the functional earth port of the EUT will be
tested using this basic standard.  If the earth is to be lifted, how is this
possible?

I was not a member of this community in 1997 thus do not have a copy of the
symposium record.  Is it available on the IEEE site?
Thanks again for your quick response.
Dan Kinney

> -----Original Message-----
> From: Ken Javor [SMTP:[email protected]]
> Sent: Friday, February 14, 2003 4:41 PM
> To:   Dan Kinney (A); Oliver Betz; [email protected]
> Subject:      Re: Grounding of EUT in EN61000-4-6 conducted immunity test
> 
> I was working off IEC 1000-4-6 (1996), Figures 2 and 5b, which cover
> direct
> injection and show the EUT isolated above ground.  Figure 6 shows clamp
> injection and EUT isolation above ground.  What you are referencing is a
> special case in the annex when the cm 150 Ohm impedance cannot be met.
> The
> theory is, I believe, as I stated before.  Incidentally clamp injection is
> fundamentally different than CDN injection.  CDN injects line-to-ground,
> and
> clamp injects in series with the cable.  The standard specifically says
> that
> when using a clamp installed between EUT and AE, the AE must be an equal
> or
> lower impedance than the EUT.  This is opposite of what you want with a
> CDN.
> My paper covers that issue in detail.  It appeared in the 1997 IEEE EMC
> Symposium record, page 479.
> 
> Ken Javor
> 


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