All,
In the past, I have tried to maintain a creepage & clearance
distance of 100 mils (~2.5 mm) for digital signals and ground from the front
board edges in a modular chassis configuration to meet EMC requirements. With
the faceplates of the I/O modules referenced to shelf ground through retention
screws, I'd run a shelf ground etch down the front of the PCB approximately 50
mils (~1.25 mm) providing additional connections from the faceplate mounting
screws to the shelf ground etch along the front of the PCB.
I am interested in hearing from others with regards to their
design practices for compatibility with EMI, ESD, Immunity, etc. and the
spacings used. Many times, based on available real estate, concessions were
made to violate the design rules. This was always done on a case by case
basis. Please feel free to flood me with information.
Thx,
Joe
Joe Finlayson
Motorola
120 Turnpike Road
Southborough, MA 01772
Tel: (508) 357-8273
Fax: (508) 357-8289
Email: <mailto:[email protected]>
[email protected]
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