Jim - Other details aside, component manufacturers need to service the industries that produce products that are not exempted in Annex. I've heard rumor that some component manufacturers are anticipating removal of the indicated exemptions and are planning to eliminate Pb "tinned" components from their offerings (only a rumor, mind you, I have made no attempt to verify it).
Because the lead-free manufacturing technologies available to date almost exclusively require higher temperature processes than the commonly used lead processes, the component manufacturers are having to modify their products to meet the harsher board assembly environment. I've been told the presence of Pb on component leads is generally not compatible with the Pb-free processes. There are also solder joint reliability concerns, since the technologies are relatively new. Regards, Peter L. Tarver, PE [email protected] > -----Original Message----- > From: [email protected] > [mailto:[email protected]]On > Behalf Of Jim Bacher > Sent: Friday, October 29, 2004 4:37 AM > To: Emc-Pstc (E-mail) > Subject: Lead and RoHS > > > We were reading a copy of the RoHS that we retrieved from: > http://www.dti.gov.uk/sustainability/pdfs/finalroh > s.pdf and found it to be > interesting. As a result we have questions, but > first the key parts that > raise the questions: > > In Article 4 / Prevention it says: > > 1. Member States shall ensure that, from 1 > July 2006, new > electrical and electronic equipment put on the > market does not > contain lead, mercury, cadmium, hexavalent > chromium, polybrominated > biphenyls (PBB) or polybrominated diphenyl > ethers......... > > 2. Paragraph 1 shall not apply to the > applications listed in the Annex. > > Then in the Annex it says: > > 5. Lead in glass of cathode ray tubes, > electronic components and > fluorescent tubes. > > 7. - Lead in high melting temperature type > solders (i.e. tin-lead solder > alloys containing more than 85 % lead), > - lead in solders for servers, storage and > storage array systems > (exemption granted until 2010), > - lead in solders for network infrastructure > equipment for switching, > signalling, transmission as well as network > management for telecommunication, > - lead in electronic ceramic parts (e.g. > piezoelectronic devices). > > > Most component companies are now working on > getting the lead out, but the > way I read this they do not need to. What is > meant by electronic component? > Could I call our assemblies an "electronic > component" and not have to change > anything? Comments? Thoughts? > > > Jim > This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Ron Pickard: [email protected] Scott Douglas [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
