Hi Jim
There is some useful general information on the "Reliability and Failure
Analisys" ("RFA") section of the ERA Technology Website @
http://www.era.co.uk/Services/RoHS.asp, and they
Paul Goodman lead the RoHS activities and the preparation of some of the
reports which the DTI is using as the basis of current work in this area - you
might want to contact him at the cc email address as he can probably provide
you with most of the detailed information that you need.
Regards
John Allen
ERA Technology Ltd.
Leatherhead
UK
-----Original Message-----
From: Jim Bacher [ mailto:[email protected]]
Sent: 29 October 2004 12:37
To: Emc-Pstc (E-mail)
Subject: Lead and RoHS
We were reading a copy of the RoHS that we retrieved from:
http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf and found it to be
interesting. As a result we have questions, but first the key parts that
raise the questions:
In Article 4 / Prevention it says:
1. Member States shall ensure that, from 1 July 2006, new
electrical and electronic equipment put on the market does not
contain lead, mercury, cadmium, hexavalent chromium, polybrominated
biphenyls (PBB) or polybrominated diphenyl ethers.........
2. Paragraph 1 shall not apply to the applications listed in the Annex.
Then in the Annex it says:
5. Lead in glass of cathode ray tubes, electronic components and
fluorescent tubes.
7. - Lead in high melting temperature type solders (i.e. tin-lead solder
alloys containing more than 85 % lead),
- lead in solders for servers, storage and storage array systems
(exemption granted until 2010),
- lead in solders for network infrastructure equipment for switching,
signalling, transmission as well as network
management for telecommunication,
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
Most component companies are now working on getting the lead out, but the
way I read this they do not need to. What is meant by electronic component?
Could I call our assemblies an "electronic component" and not have to change
anything? Comments? Thoughts?
Jim
Jim Bacher, Senior Engineer
Paxar Americas, Inc.
170 Monarch Lane
Miamisburg, Ohio 45342 USA
e-mail: [email protected]
voice: 1-937-865-2020
fax: 1-937-865-2048
----------------------------------------------------------------
This message is from the IEEE Product Safety Engineering Society
emc-pstc discussion list. Website: http://www.ieee-pses.org/
To post a message to the list, send your e-mail to [email protected]
Instructions: http://listserv.ieee.org/listserv/request/user-guide.html
List rules: http://www.ieee-pses.org/listrules.html
For help, send mail to the list administrators:
Ron Pickard: [email protected]
Scott Douglas [email protected]
For policy questions, send mail to:
Richard Nute: [email protected]
Jim Bacher: [email protected]
All emc-pstc postings are archived and searchable on the web at:
http://www.ieeecommunities.org/emc-pstc
_____________________________________________________________________
This e-mail has been scanned for viruses by MCI's Internet Managed Scanning
Services - powered by MessageLabs. For further information visit
http://www.mci.com
**********************************************************************
Copyright ERA Technology Ltd. 2004. (www.era.co.uk). All rights reserved. The
information supplied in this Commercial Communication should be treated in
confidence.
No liability whatsoever is accepted for any loss or damage
suffered as a result of accessing this message or any attachments.
**********************************************************************
_____________________________________________________________________
This e-mail has been scanned for viruses by MCI's Internet Managed Scanning
Services - powered by MessageLabs. For further information visit
http://www.mci.com