John - consider this resource on board stack up
http://www.hottconsultants.com/
And specifically
http://www.hottconsultants.com/tips.html - see PCB stack up.
This was a great help to me as were several members of our group.
 
BTW - my project I talked about ~ a year ago is nearing production and on my
Alpha boards I achieved Class B emissions and high noise immunity.
For example I passed EN61000-4-3 at 35V/M with 80% 1KHz AM mod. This is to
coordinate with ANSI C37.90.2 and insure some head room.
I have both 8 and 10 layer boards.  The 10 layer board has DSP running at
133MHz and powered at 3.3 and 1.8V.
If you remember I had an odd split analog arrangement and that has turned out
to behave as well despite the digital noise making right in the middle.
Thanks to all that gave me guidance!  Right now I am receiving some Beta
boards (set prior to production build) and I hope we did not step on anything.
 
I am curious if any have experience with the high capacitance boards which
increase the dielectric constant between power and ground by adding ceramic
material to the prepreg?
This is referred to as "Buried Capacitance"
See http://www.sanmina-sci.com/Solutions/pdfs/Licensee_List.pdf
See bottom of note http://www.hottconsultants.com/techtips/decoupling.html
I believe you need to have ground planes that cover entire board and I have
isolated sections so I suspect it would not work.
As I undertand it there are some mechanical warping issues with out a
continous ground plane over the entire board.
I was thinking this technology could give me a way out if Lab Validation
testing does not cofirm my prescreening.
Also I have not studied how this technology effects the trace/PCB
characteristic impedance.
Presently my boards are designed to 50 ohms and the peripheral busses run at
133 MHz.  
This is the highest speed board I have worked with and am blazing new
territory for our embedded designs.
Lastly - My design has 5 BGAs on the 10 layer board and I asume this type of
PCB would effect the thermal profile.
Is it hard to adjust to?
 
Chris Wells - Fellow Engineer, Eaton Electric
[email protected]
 

----- Original Message ----- 
From: [email protected] 
To: [email protected] 
Sent: Wednesday, December 08, 2004 5:37 PM
Subject: Design for emc and pcb stack-ups


Hello, 

I am embarking on an electronic design for a cctv camera that will employ 8 or
10 layer PCB. 
It will include a high speed DSP (400-600MHz internal clock) that requires
both 3V3 and 1V2 supplies 

I am considering employing dual power planes rather than segment a single
power plane. 

I would appreciate any feedback on... 

reference material that outlines pros/cons of either solution single or dual
plane. 
Material describing stack options for optimum emc - 8 or 10 layer? 

Most of the references I have reviewed do not directly address dual power
layers in the stack. 

Any comments appreciated. 

Thanks 
John Coyle
Senior Engineer
Video Systems
6554 - 176th Street
Surrey, BC Canada V3S 4G5
                                            _____  Honeywell 
604.574.1526 x8633                           [email protected] 
604.574.8523 Fax




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