Jeff -
Having calculated reliability with both models, my input is:
1) Model differences: MIL-HDBK-217F/G factors for plastic encapsulated parts,
pin-count and non-MIL quality were unrealistic in 1991 (quite pessimistic)
2) if system reliability is to be calculated from subsystem rel, subsystem rel
should use the same model.
Otherwise the system reliability report will be inaccurate or very messy; rel
can vary 10X to 20X depending on parameters selected
3) generic failure rates transpose from 217 to 332 using a 1000X factor.
(carefully match the environment if using the parts-count Annex, and document
the source(s))
IC failure rates
217's IC failure rate extrapolations from 1980's data are no longer valid
(predicted MTBF for a 2-GHz PC is only a few minutes). Obtain recent data and
document the source.
.
Honeywell
David W. Sterner
Quality Assurance Engineering
Security & Custom Electronics
165 Eileen Way
P.O. Box 9035
Syosset, NY 11791
Phone: (516) 921-6704 x6970
Fax # (516) 364-6953
[email protected]
<http://www.honeywell.com <http://www.honeywell.com/> >
_____
From: [email protected] [mailto:[email protected]] On Behalf Of jeff collins
Sent: Thursday, March 15, 2007 3:46 PM
To: [email protected]
Subject: Medical Products: Telcorda SR-332 vs.Mil-HDBK-217
Group,
For those of you who are involved with Medical products and MTBF Prediction,
what reliability standard/method do you use? ( Telcordia SR-332 or
MIL-HDBK-217)
I normally use MIL-HDBK-217 for medical products and Telcordia SR-332 for
Telecom or similar products. I'm working on a medical product where they have
requested all of their MTBF Predictions to Telcordia SR-332.
Thanks for any insight you may have on this topic.
Regards,
Jeff Collins
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