Hi All, We are laying out our first product with an on board phone interface. I am curious as to how much spacing is generally needed between traces to pass the part 68 surge and hi-pot test. I found one reference that said 25 mil and that the power and ground should be voided around the phone traces on the network side. It is a 4 layer board.
Thanks in advance Tony _________________________________________________________________ Exercise your brain! Try Flexicon. http://games.msn.com/en/flexicon/defaul .htm?icid=flexicon_hmemailtaglineapril07 - This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please visit http://www.messagelabs.com/email ______________________________________________________________________
