Hi Everyone, My latest Technical Tidbit article is up!
Abstract: An IC package "shield" made from copper foil tape can be used for troubleshooting a number of problems including ground noise and some ESD problems. Construction of such a shield and its applications are discussed. Discussion: Figure 1 shows an example of a "shield" made of copper foil tape <http://emcesd.com/tt090100.htm> which is connected to the ground pins of an IC package with short wires. Sometimes the copper foil tape is not necessarily acting as a shield but instead to improve the grounding under the IC such as in single and two layer boards. Used either as a shield or to improve grounding, such a structure can act as a troubleshooting aid for a number of PCB problems. Examples of such problems include: The address is: http://emcesd.com/tt2011/tt050411.htm Doug -- ------------------------------------------------------- ___ _ Doug Smith \ / ) P.O. Box 1457 ========= Los Gatos, CA 95031-1457 _ / \ / \ _ TEL/FAX: 408-356-4186/358-3799 / /\ \ ] / /\ \ Mobile: 408-858-4528 | q-----( ) | o | Email: [email protected] \ _ / ] \ _ / Website: http://www.dsmith.org ------------------------------------------------------- - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. To post a message to the list, send your e-mail to <[email protected]> All emc-pstc postings are archived and searchable on the web at http://product-compliance.oc.ieee.org/ Graphics (in well-used formats), large files, etc. can be posted to that URL. Website: http://www.ieee-pses.org/ Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas <[email protected]> Mike Cantwell <[email protected]> For policy questions, send mail to: Jim Bacher <[email protected]> David Heald <[email protected]>
