gene heskett wrote: > Ed Nisely had > an article in CC some time back where he used a toaster oven for that, > IIRC. I also do production work with a toaster oven! I have a ramp and soak temperature controller from Omega, and found the best control was to poke the thermocouple into a plated through hole in the board to sense actual board temperature. If I try to sense air temperature, the boards get burned black.
This works amazingly well! The REAL trick, however, is getting the right amount of solder. I use 3 mil stencils (~.075mm) photo-etched from brass shim stock. For fine-pitch ICs, you have to cut down the size of the apertures WELL below the pad size. If a little too much solder is there, you get bridges. With just a little more solder, the whole chip lifts up on a moat of solder and floats out of alignment. That is a MAJOR mess to rework. For the chip-scale packages with no exposed leads, you get a lot of shorting under the chip where you can't inspect. This is a major pain to debug and rework, so after one HORRENDOUS experience with 64 of those parts per board, I have avoided that type of package. Jon ------------------------------------------------------------------------------ Ridiculously easy VDI. With Citrix VDI-in-a-Box, you don't need a complex infrastructure or vast IT resources to deliver seamless, secure access to virtual desktops. With this all-in-one solution, easily deploy virtual desktops for less than the cost of PCs and save 60% on VDI infrastructure costs. Try it free! http://p.sf.net/sfu/Citrix-VDIinabox _______________________________________________ Emc-users mailing list Emc-users@lists.sourceforge.net https://lists.sourceforge.net/lists/listinfo/emc-users
