At last something I can understand,,In the late 1960's I heard a comment that the next great breakthrough would be three dimensional chip architecture, at that time it was thought that heat dissipation would become the biggest hurdle

What causes most of the slowdown in going from CPU to main memory is
the pads and PC board.  On chip signals have orders of magnitude less
capacitance and so can go at least an order of magnitude faster.

One technology that is being considered is optical interconnect.  That
would provide a tremendous speedup to this pathway.  The technology
isn't ready yet.  I don't know how long it will take to appear.

But once you have optical interconnect, it can be used on chip as
well as off chip.  Recall that Herb indicated the speed limit of
current processors is basically caused by interconnect.  Optical
interconnect changes that and greatly reduces the speed cost of long
distance signaling

Perhaps vertical integration is waiting for optical interconnects, which would probably be GaAs due to higher speed than Si as well as higher efficiencies
WF


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