Hi Michael, Thanks for sharing your thoughts.
In fact, I did split the huge upload into separate tar files. Besides, I removed the vendor SDK from the upload. Since this SDK is designed by the chip vendor, I think the package should be composed of proprietary codes designed by the vendor. It isn't suitable to be scanned for OSS compliance. We should focus on the the codes designed by ourselves.. By uploading the tar file composed of our own design, we could get the unified Report successfully. Thanks for your help. Todd -=-=-=-=-=-=-=-=-=-=-=- Links: You receive all messages sent to this group. View/Reply Online (#3454): https://lists.fossology.org/g/fossology/message/3454 Mute This Topic: https://lists.fossology.org/mt/82741191/21656 Group Owner: fossology+ow...@lists.fossology.org Unsubscribe: https://lists.fossology.org/g/fossology/unsub [arch...@mail-archive.com] -=-=-=-=-=-=-=-=-=-=-=-
