> I started out by using one of the fiducials you guys have listed > with a pad as a sub-element. However when I started reviewing my > PCB with my assembler rep he noticed that their would be a hole in > the stencil causing solder paste to be applied to the fiducial. I > changed to the pin with zero size hole and the paste is naturally > gone. However now I have fiducials on both sides with a big hole in > my GND plane because of the clearance to the GND polygon. So, is > their a way to get PCB to not put paste on a pad so I can go back to > having a fiducial on one side of the board?
At the moment, we don't have any way of adjusting the paste size. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
