Hi Dave and all, On Wed, 2007-06-06 at 11:24 -0700, Dave N6NZ wrote:
> a) pcb paste layer gerber is directly from the pad layer, and I think in > many cases that lays down too much solder. I haven't experimented > enough to be able to say for sure. I'd like to see some paste layer > control added to the footprint definition. > Since this is on a per thickness, per material basis for the stencil involved, I think this could be better handled in a specific "stencil" exporter with a configurable positive(=larger) or negative(=smaller) offset value for the pad-outline. > b) My current method for prepping a file for the laser cutter is a bit > of a kludge. Ideally, I'd like to see the gerber previewer have the > option of exporting .dxf of the pad outlines from the paste layer. > If the exporter can be made configurable for not doing fill operations on a pads in a pads-only-mode, then it's also possible to do this for a DXF exporter. Kind regards, Bert Timmerman. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
