Hi, On Sat, 6 Oct 2007 09:37:34 -0400 Randall Nortman <[EMAIL PROTECTED]> wrote:
<snip> > Speaking of vias -- Anybody have any experience putting them right > under an SMD pad? I'm not thinking of doing that for the little 0.5mm I'd try to avoid them. I have supported a board design where every now and then we get a board back with a broken CAN bus. The CAN bus chips have vias underneath some pins. resoldering the CAN bus transceivers usually sorted all problems but they tended to return after a few months leaving the CAN bus again in a sorry state. I think these problems are all caused due to heat. HTH, Hans -- $ cat .sig /dev/null _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
