Dave N6NZ wrote: > To recap: I have been experimenting with making solder paste stencils > from laser cut drafting mylar. The current implementation of paste > layers is not very flexible. The paste stencils that result from my > current workflow apply way too much solder (for various reasons).
Glad to hear you are experimenting with this Dave. It's much appreciated. All this: "Maybe you could write a laser-paste exporter? Then, you could ask the user for the offset they need, and output whatever language you need to run the laser directly. > > OK, I will look that up, it sounds related. But there is a reason I > > thought that paste should be detached from pads, and that is that for > > some cases you may not have 1:1 correspondence between pad and paste > > shapes. That's why multi-pins have paste and mask specified separately from copper, for each layer. > > I'm advocating for a true paste layer. What's an anti-paste layer? > > Do I want one of those, too? anti-paste removes paste. Thus, you could use anti-paste to cut up a big thermal pad, or not put paste on unpopulated parts." sounds good to me. Either programming paste from attributes attached to a pad or multipin pad or from pad/ps-bloat/anti-paste combinations sound workable. Thanks, John Griessen -- Ecosensory Austin TX _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
