Thanks for the link - I've looked at that page before, but I just thought I'd test if someone had an experience which clearly favored one over the other.
-Ethan Eric Brombaugh wrote: > epswint wrote: >> Now, the question: I've observed two different techniques for tying >> analog and digital ground planes on mixed-signal boards. The first >> technique placed the tie-in directly under the analog/digital converter >> on the MCU, the second technique placed the tie-in at the far edge of >> the board between the analog and digital connectors. Both boards were >> MCU development boards, laid out so that roughly one quadrant of the >> board was analog, the rest digital. I've got all of my components >> placed and ready to go, just wondering what experience/thoughts the >> user-list had on the subject. >> > That's a $64,000 question. Both ways will work if handled carefully, and > which one you use depends on your previous experience and the design > requirements. > > Analog Devices has a pretty good tutorial on this: > > http://www.analog.com/en/content/0,2886,761%255F795%255F97529%255F0,00.html > > > Eric > _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
