Hi, How do I include heat sinks into the pcb layout. I have a schematic (in gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ case. I am developing the footprint for the GBJ case but the process is complicated by the fact that the component can either be mounted vertically or bent over flat (hole through part). The bent over flat would seem to be the hardest because the heat sink and the component will be superimposed on the board layout.
Thank you in advance for any help. You guys are really responsive. Gary L. Roach _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
