On Thu, Jul 17, 2008 at 12:56 PM, Gary L. Roach <[EMAIL PROTECTED]> wrote:
> Hi, > > How do I include heat sinks into the pcb layout. I have a schematic (in > gschem) that needs heat sinks on 2 components. One a TO220 and one a GBJ > case. I am developing the footprint for the GBJ case but the process is > complicated by the fact that the component can either be mounted > vertically or bent over flat (hole through part). The bent over flat > would seem to be the hardest because the heat sink and the component > will be superimposed on the board layout. > I make a separate footprint with a heatsink silkscreen. I have a TO-220 with a heatsink on my geda page. http://www.luciani.org/geda/geda-index.html I usually draw outlines around mounting holes and mounting hardware to give myself "hints" when I do the board layout. See some of my mounting hardware footprints. (* jcl *) > > Thank you in advance for any help. You guys are really responsive. > > Gary L. Roach > > > _______________________________________________ > geda-user mailing list > [email protected] > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > -- http://www.luciani.org
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