Marcel Schmedes just posted this link http://www.luciani.org/images/drawdio_r0_top.jpg
which reminds me to the question of the benefit of oval pads on the component side for through hole parts like DIP. I can see the benefit on the solder side, so my footprint generator has the option to make ovals on the solder side for DIP and SIP, but not on component side. Do I miss something (of course it's easy to add this feature). Best regards Stefan Salewski _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
