On Tue, 21 Apr 2009, Stefan Salewski wrote: > Marcel Schmedes just posted this link > > http://www.luciani.org/images/drawdio_r0_top.jpg > > which reminds me to the question of the benefit of oval pads on the > component side for through hole parts like DIP. I can see the benefit on > the solder side, so my footprint generator has the option to make ovals > on the solder side for DIP and SIP, but not on component side. Do I miss > something (of course it's easy to add this feature).
For hand assembly, if components need to be soldered both sides (for home made boards, if a component leg can be a via, it saves me from drilling another hole elsewhere) it makes it easier to get more of the soldering iron tip on the copper and run the solder in. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
