On Fri, 2009-10-23 at 06:45 -0400, Ethan Swint wrote: > On 10/23/2009 05:58 AM, gene glick wrote: > > How can I make a mounting hole that does: > > 1. top/bottom side plated round pad, e.g. .250" > > 2. connected from top to bottom with a plated hole > > 3. inner layer clearance is just the normal clearance around the hole, > > say .010" > > > > > Presently, PCB can't do different pads on different layers. I can think > of two ways to do this: > 1) Make a via with no pad, then make a solid thermal to a polygon which > approximates a circle on top and both. Finally, an arc trace can cover > over the jagged edges.
The polygon would get covered by mask, so that is no good. > 2) Make an element with two rounded pads, same location, but one with > the flag "onsolder". Then put a pin through that has zero (or minimal) pad. That is the only way I can think of unfortunately. Best regards, Peter C. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
