On Fri, 23 Oct 2009 15:24:15 -0400, DJ Delorie wrote:
> Draw a smaller via (the inner layer diameter). > > Set your LINE width to the larger size, draw a line from the via to > somewhere else. > > Move the "other" end of that new line back to the via, leaving a large > round copper "line" on top of the via. This large round copper line would be covered with solder mask - probably not the desired behavior. Of course you can set the mask clearance of the via to the large diameter. But then you get the same clearance on the bottom side, too. ---<(kaimartin)>---- -- Kai-Martin Knaak Öffentlicher PGP-Schlüssel: http://pgp.mit.edu:11371/pks/lookup?op=get&search=0x6C0B9F53 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
