In the photo you included, the physical stackup would be: component solder outline GND power signal1 signal2 signal3
Note that the lesstif HID uses the same type of layout grid. If you're iterating from 0..max_layers, just use it as the array index into PCB->LayerGroups.Entries[]. The only catch is, if the component group is *after* the solder group in the list, you iterate backwards. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
