> Whatever we do, it is still useful to be able to designate component > / solder side groups (or have some means to define physical > stack-up) so that pads can be rendered on the right layers ;)
I figure we need each layer to specify: * type (copper, silk, mask, anti-copper, keepout, etc) - probably a set of values: base type plus flags for "anti" etc - maybe a sequence number for layering, like anti-silk over silk rectangles, etc. * layer class (top, bottom, inner) * OR specific layer (0..N based on the stackup) So a footprint could specify clearance on all inners, or copper on just the inner under the traces, etc. So a (top,silk) solid rectangle, above that a (top,silk,anti) text, gives us "black" text on a "white" area... But I figure the top/inner/bottom "class" is what we need for importing footprints. They'd be layered by class, not number, so they can adapt to whatever number of layers the board has. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
