> > I pre-soldered all pads, thus connections were better. I never pre-soldered any pins but one at one corner to initially fix the component. I'm using a tip with a very small point (0.4mm = 1/64") that easily fits between the 1.27mm pitch (= 1/20") pins of SOIC packages. With a thin solder wire (0.5mm) and a reasonably high temperature (~330°C = 640°F) soldering is quick and clean. Never had any problem, even with lead-free solder. But I admit it might need a bit of practice, and I only use professionally made PCBs with solder resist. Without solder resist, it may be a lot harder.
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