2012/6/28 Lorenzo Marcantonio <[email protected]> > On Thu, Jun 28, 2012 at 02:50:51PM +0200, Miguel Angel Ajo Pelayo wrote: > > *this can cause trouble at manufacturing if not well handled but it's a > > good way to reduce parasitic impedance*. > > You need to make sure that solder paste stays on the pad and don't go > down the via. It's also used with BGAs in a (somewhat expensive) process > called 'pads on via' >
Yes, that's what I meaned, you can tempt the vias in the other side, and if they are small enough no paste will pass. But tempting vias won't be good if your purpose was thermal. > IIRC there is nothing in the drc which block 'colliding' components (we > don't either have courtyard information to do that) so it should work > without problem. Nice then, but it will be something to care about if it's implemented at any time. > -- > Lorenzo Marcantonio > Logos Srl > > _______________________________________________ > Mailing list: https://launchpad.net/~kicad-developers > Post to : [email protected] > Unsubscribe : https://launchpad.net/~kicad-developers > More help : https://help.launchpad.net/ListHelp > -- Miguel Angel Ajo Pelayo http://www.nbee.es +34 636 52 25 69 skype: ajoajoajo
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