On Wed, Jun 27, 2012 at 11:13:25AM +0200, Samuel Lesueur wrote: > Imagine if we can add a feature that draw those termal vias during the > "zone filling" process. It would be so usefull for power designers !
I actually have modules with an array of tht pads :D This also solves another via problem: currently vias can only be all tented or all untented (it's a plot option). Thermal vias should be untented (for obvious reason), impedence vias do not. So the via-module is a trick to have untented via with an otherwise tented design. As a bonus you can add these pads to another layer (adhesive, for example) to specify filled vias, if you need that kind of technology... Before adding the floating via I would enrich first the via data structure, otherwise it's not very useful... -- Lorenzo Marcantonio Logos Srl _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : [email protected] Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
