Hi, there! On 2016-06-12 17:25, Cheng Sheng wrote: > [...] > What it does is: If a via appears on F.Cu layer, print it also on F.Mask > layer; same for B.Cu layer via on B.Mask layer.
This "feature" - to open up (selected) vias in the solder mask - seems especially useful when vias are used as testpoints (for flying-probe- or in-circuit-testing, etc.). In some other designtool there are rules envolved that these vias can be placed automatically to make nets available on some side and they only become a testpoint when the clearance to a component outline or courtyard is above some probe diameter. Then, there are rules if the vias should be opened on top, bottom or both sides, depending how the board gets probed. Wishlist: It should be possible to automatically selectively open up vias on top/bottom from the solder masks following some of these given rules. Regards, Clemens _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : [email protected] Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
