Well there are the IPC standards that define standard footprints for a whole
range of packages. There are several pages of xQFPs with different body
sizes, pitches and aspect ratios. The manufacturer will define the package
the chip is placed in depending on pin count, die area and cost. Really the
only way to be sure is to check the datasheet for the specific chip you are
using.

 

MarkW

> Does anybody know the different origins of the "xQFP's"?
>



 


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