> This is probably how you would do it in KiCad as well. However, you can assign > the same pin name when creating the footprint, so they will be automatically > be connected (via ratsnest).
I recently did this under a BGA. The problem started because there is no grid alignment capability in PCBNEW. So after my BGA was placed, I found it extremely difficult getting the VIAs to go exactly centered between the ball pads. Yes I could use a smaller grid interval setting, but then with this small granularity you still had to guess where the center of the area was. With a larger grid interval, I could not get the grid multiple to coincide with the center of the area without moving the part, and I found that difficult. So I went back to the module editor, and put through hole pads between the SMD pads, and gave them each a name and pin number identical to the SMD pad they were to be tied to. In the pad editor for such through hole pins, I had to make sure the solder mask covered the through hole pads, essentially making them vias. When placing the new part, the through hole pins became essentially unconnected vias, but they were already in the ratsnest with a net code. I just had to connect them with a short track to the corresponding ball pad. There were a few cases where I ended up deleting the through hole pad when I did not need a via there. Then ultimately went back and updated my library component with the deleted through hole pads from the board copy of the component itself. HTH Dick
