Hi, Yes, there is. Select a grid half the distance between ball centres while routing the BGA. This is one of the uses of the user grid.
Pedro. > I recently did this under a BGA. The problem started because there is > no grid alignment capability in PCBNEW. So after my BGA was placed, I > found it extremely difficult getting the VIAs to go exactly centered > between the ball pads. Yes I could use a smaller grid interval > setting, but then with this small granularity you still had to guess > where the center of the area was. With a larger grid interval, I > could not get the grid multiple to coincide with the center of the > area without moving the part, and I found that difficult. > > > So I went back to the module editor, and put through hole pads between > the SMD pads, and gave them each a name and pin number identical to > the SMD pad they were to be tied to. In the pad editor for such > through hole pins, I had to make sure the solder mask covered the > through hole pads, essentially making them vias. When placing the new > part, the through hole pins became essentially unconnected vias, but > they were already in the ratsnest with a net code. I just had to > connect them with a short track to the corresponding ball pad. There > were a few cases where I ended up deleting the through hole pad when I > did not need a via there. Then ultimately went back and updated my > library component with the deleted through hole pads from the board > copy of the component itself. > > > HTH > > Dick >
