Hi Robert, Interesting manufacturer you've got there. No, Kicad does not have the ability to shrink the solder past pads as it can increase pad sizes on solder resist layer. I myself just finished a PCB where I only had to shrink solder paste for 2 fine-pitch connectors. I did it by not using the original pad for paste but added a smaler drawing for each pad. Man, that was a lot of work, the connector has 60 pins. On the standard components, the manufacturer said it's ok to leave it 1:1. Aparently, the needed shrinkage depends on pad size and how the stencil is manufactures (etched, lasered, electro-polished) but also on the thickness of the stencil. Maybe going to a thinner stencil might be a solution for you, they are usually available down to 100um/4mil.
Cheers, Heiko --- In kicad-users@yahoogroups.com, Robert <birmingham_spi...@...> wrote: > > Hi all, > > I've been asked to shrink the size of the solder paste windows relative > to the pads by 0.04mm, ie if a pad is a 1mm diameter circle, I've been > asked to make the solder paste window 0.96mm in diameter. Does anyone > know how I might achieve this please, either with kicad or via some > post-processing stage? > > Regards, > > Robert. >
