>If you look at the Kicad libs, you will find a similar system, there are [>] >DIP-8__300, and DPI-8__300_ELL, which are the same outline but with [>] >different pad settings.
[>] Tnks andy for this precise answer. But it doesn’t solve my problem, as I absolutely need a pad design able to accept both “thru hole” and CMS components (and not 2 separated and different modules). The real problem is that I cannot predict which component will be used in the future, depending on the market price, the availability and so on.. I need to keep all options as open as possible. Anyway, you’re right, the question of the soldermask remains.. … or shoud I “stack” 2 different modules à the same place to avoid this kind of problem ? and if this is the answer, how could I “call” an external module after my placement ? Mark
