I have the problem of too wide opening for the stensil made from solder paste
layer. Which results in too much solder paste applied for QFN and lots of
solder bridges in manufacturing. However reducing the solder paste of specific
modules seems to be a challenge in current released version: 20090216.
Just wandering when will anything enabling the editing of solder paste opening
be available... Or what is the result of those old discussions as below?
Regards,
Wei
--- In [email protected], "spernecker" <pernec...@...> wrote:
>
> --- In [email protected], "Dick H." <dick@> wrote:
> >
> > --- In [email protected], Bús József <busj@> wrote:
> > >
> > > Hi
> > >
> > >
> > > I made the patch for the SMD pad, to do the reduction of Solder
> > Paste Mask size.
> > >
> > > Uploaded the patch file and pictures the
> > http://tech.groups.yahoo.com/group/kicad-users/files/busj/ folder!
> > >
> > > Regards,
> > > BusJ
> >
> > The person who raised the issue wanted module/footprint specific
> > control. In my mind this means having to add support in the module
> > editor for setting this into a module. The module editor could have a
> > default setting which would defer to the global setting, similar to
> > how default vias defer to the global hole size.
> >
> > I am open to your thoughts on how easy it would be bridge this gap in
> > concept. However as is, I will not be adding the patch. More
> > discussion and improvements are needed.
> >
> >
> > Dick
> >
> Hello guys, I'm a new Kicad user and I have a problem when I design new
> module with very small smp pad. It's glue the net togheter. I want maybe try
> your path but I don't understand what I need to do to apply this. Thank for
> your help.
>
