I am experiencing problems with a board that I design using KICAD.
It is almost impossible to remove all solder from a hole. I am wondering if I have enough clearance between the component lead and hole. Even after I use heat to remove the component, getting all the solder out of the empty hole is very difficult using traditional industry techniques. I am wondering if there is an error in the libraries and the specification for the holes or if this is an issue to do with the manufacturing company that is making the boards for me??
