What are you using to de-solder? Pump or wick? I use the wick with pretty good results.
On Sun, 2010-02-28 at 22:38 -0500, juliorz wrote: > > I am experiencing problems with a board that I design using > KICAD. > > > > It is almost impossible to remove all solder from a hole. I am > wondering if I have enough clearance between > > > > the component lead and hole. Even after I use heat to remove the > component, getting all the solder out of the > > > > empty hole is very difficult using traditional industry techniques. > > > > > > I am wondering if there is an error in the libraries and the > specification for the holes or if this is an issue to do > > > > with the manufacturing company that is making the boards for me?? > > > > > > > > >
