Hello, I'm trying to make a footprint for a "thing" that TI calls a "PowerPad" and is in fact an MSOP-10 with a thermal pad that has 5 holes going to the bottom where I think there is another pad. See TLV4113 in DGQ package.
I found a footprint in "m-pad-2.1" but it's wrong, anyway that's what I'm modifying. How do I put 5 holes it the center pad? Or, does somebody have a footprint that works? Thanks, Cat
