Hi, I created 2 or 3 power pad TI components. The way I did it is just creating extra standard pads with the same number on top of a rectangular smd pad with the same number
Christophe --- In [email protected], "catalin_cluj" <catalin_c...@...> wrote: > > Hello, > I'm trying to make a footprint for a "thing" that TI calls a "PowerPad" and > is in fact an MSOP-10 with a thermal pad that has 5 holes going to the bottom > where I think there is another pad. > See TLV4113 in DGQ package. > > I found a footprint in "m-pad-2.1" but it's wrong, anyway that's what I'm > modifying. > How do I put 5 holes it the center pad? > Or, does somebody have a footprint that works? > > Thanks, > > Cat >
