On 6/21/06, Stewart Stremler <[EMAIL PROTECTED]> wrote:
begin quoting Andrew Lentvorski as of Tue, Jun 20, 2006 at 10:12:02PM -0700:
> Stewart Stremler wrote:
>
> >That may be insufficient for modern CPUs. But wouldn't it be neat if
> >they'd build in peltier cooling in the _chip_?
>
> Uh, why would I want to fold something which generates heat into my chip
> that already produces too much heat?
Because you'd get finer control over what parts of the chip are
getting cooled, and when?
> Peltier devices don't just magically make things cool. They have to
> ship that heat somewhere. And, BTW, Peltier devices also *generate*
> quite a bit of heat by themselves. For every amount of heat they move,
> they generate about 4x more heat of that same amount.
Well, they aren't very efficient... :)
> *ALL* of that heat has to be dissipated somehow.
Yes. But if it's getting dumped into a heatsink eight inches (or eight
feet) from the actual chip, it's somebody else's problem.
Consider that these devices are properly called Peltier Junctions.
The heat transfer takes place across a thin solid-state junction.
Then you have to remove the heat from the "back" side by some other
means. It isn't inches or feet away, it's millimeters away.
Side comment: the air-cooling vs. water-cooling problem has been
worked over thoroughly in the automotive engine field during the past
century or so.
carl
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carl lowenstein marine physical lab u.c. san diego
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