On Tue, Apr 9, 2013 at 2:47 PM, Matthew Gretton-Dann < [email protected]> wrote:
> On 09/04/13 00:20, Alexander Sack wrote: > >> Paul, >> >> you suggest to use different configurations for doing the "build the >> kernel" validation and the benchmarking? Why wouldn't we run in the same >> heat issues while benchmarking? >> >> Can we somehow put the SoC into a very low power state for 2 minutes for >> cool down and simply wait before starting the build/test? >> > > Or we could put a heatsink/active cooling on the PandaES boards? > > As Paul says elsewhere we hammer the boards continuously for a number of > hours, being cool before we start isn't going to help much. > > > Anyway, I assume that the strict environment requirement where toolchain >> WG >> needs to sign off on the setup would mostly apply to benchmarking only and >> that we could probably choose any stable image for doing the build >> validation of the toolchain that is rock solid. Matt? >> > > Yes. > > My requirements for the kernel/filesystem image used for building are that: > a) It works > b) It doesn't change regularly :-). > I believe point b) is talking solutions for the requirement of minimal noise caused by false negatives. With that, I believe it is like I said. We can use whatever we feel is stable as long as we protect you from noise when we decide to change stuff... > For benchmarking we need to use a known good (and special) kernel and > filesystem which changes irregularly. > > Thanks, > > Matt > > -- > Matthew Gretton-Dann > Toolchain Working Group, Linaro > -- Alexander Sack Director, Linaro Platform Engineering http://www.linaro.org | Open source software for ARM SoCs http://twitter.com/#!/linaroorg - http://www.linaro.org/linaro-blog
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