On Mon, May 13, 2019 at 01:58:44PM -0400, Len Brown wrote: > > This patch series does 4 things. > > 1. Parse the new CPUID.1F leaf to discover multi-die/package topology > > 2. Export multi-die topology inside the kernel > > 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know > the difference between die and package-scope MSR. > > 4. Export multi-die topology to user-space via sysfs > > These changes should have no impact on cache topology, > NUMA topology, Linux scheduler, or system performance. > > These topology changes primarily impact parts of the kernel > and some applications that care about package MSR scope. > Also, some software is licensed per package, and other tools, > such as benchmark reporting software sometimes cares about packages.
I still think having a 'rapl package' be a 'die' is weird, but if that's the way it is specified in the SDM then so be it. Acked-by: Peter Zijlstra (Intel) <[email protected]>
