On Tue, Jun 09, 2026 at 02:08:57PM +0200, Daniel Lezcano wrote: > On 6/9/26 13:30, Dmitry Baryshkov wrote: > > On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote: > > > From: Casey Connolly <[email protected]> > > > > > > Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal > > > cooling devices backed by remote subsystems. > > > > > > On several Qualcomm platforms, remote processors (for example modem and > > > CDSP) expose thermal mitigation controls through the TMD QMI service. > > > Client drivers need a way to discover that service, map DT thermal > > > mitigation endpoints to cooling devices, and forward cooling state > > > updates to the remote subsystem. > > > > > > Co-developed-by: Gaurav Kohli <[email protected]> > > > Signed-off-by: Gaurav Kohli <[email protected]> > > > Signed-off-by: Casey Connolly <[email protected]> > > > Signed-off-by: Daniel Lezcano <[email protected]> > > > > Wrong SoB chain. > > I think Gaurav wanted to reflect the changes did a back and forth between > us, so I ended up in the delivery path somehow. I guess adding > Co-developped-by should fix the SoB but won't reflect Gaurav and Casey did > actually most of the work. So I'm fine if we remove my SoB to fix the chain
Anyway, Gaurav's SoB should be the last one (and it should be preceeded by the CdB tag) -- With best wishes Dmitry
