On 6/10/26 15:42, Dmitry Baryshkov wrote:
On Tue, Jun 09, 2026 at 02:08:57PM +0200, Daniel Lezcano wrote:
On 6/9/26 13:30, Dmitry Baryshkov wrote:
On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote:
From: Casey Connolly <[email protected]>
Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal
cooling devices backed by remote subsystems.
On several Qualcomm platforms, remote processors (for example modem and
CDSP) expose thermal mitigation controls through the TMD QMI service.
Client drivers need a way to discover that service, map DT thermal
mitigation endpoints to cooling devices, and forward cooling state
updates to the remote subsystem.
Co-developed-by: Gaurav Kohli <[email protected]>
Signed-off-by: Gaurav Kohli <[email protected]>
Signed-off-by: Casey Connolly <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Wrong SoB chain.
I think Gaurav wanted to reflect the changes did a back and forth between
us, so I ended up in the delivery path somehow. I guess adding
Co-developped-by should fix the SoB but won't reflect Gaurav and Casey did
actually most of the work. So I'm fine if we remove my SoB to fix the chain
Anyway, Gaurav's SoB should be the last one (and it should be preceeded
by the CdB tag)
Ah yes, right :)
