On 7/22/2026 12:36 PM, Krzysztof Kozlowski wrote:
On Tue, Jul 21, 2026 at 11:58:58AM +0530, Gaurav Kohli wrote:Document the optional #cooling-cells property for Qualcomm PAS remoteproc nodes so they can be used as thermal cooling devices via the QMI Thermal Mitigation Device (TMD) interface. Qualcomm remote processors expose TMD endpoints that support thermal throttling through firmware. The cooling-device specifier uses 3 cells: <&phandle device_id min_state max_state> where device_id selects the TMD endpoint (for example PA, modem, or CDSP software mitigation), with constants defined in: include/dt-bindings/thermal/qcom,qmi-tmd.h Example usage in a thermal zone: cooling-maps { map0 { trip = <&cpu_alert>; cooling-device = <&remoteproc_cdsp QCOM_TMD_CDSP_SW 0 THERMAL_NO_LIMIT>; }; }; Signed-off-by: Gaurav Kohli <[email protected]> --- .../bindings/remoteproc/qcom,pas-common.yaml | 9 +++++++++ MAINTAINERS | 1 + include/dt-bindings/thermal/qcom,qmi-tmd.h | 20 ++++++++++++++++++++ 3 files changed, 30 insertions(+) diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml index 11faf655f530..39e79a1c1079 100644 --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml @@ -77,6 +77,15 @@ properties: channels and devices related to the ADSP. unevaluatedProperties: false+ '#cooling-cells':+ description: | + Cooling device with three cells: + Cell 0: Cooling device id as defined in + include/dt-bindings/thermal/qcom,qmi-tmd.h + Cell 1: Minimum cooling state + Cell 2: Maximum cooling state + const: 3 + glink-edge: $ref: /schemas/remoteproc/qcom,glink-edge.yaml# description: diff --git a/MAINTAINERS b/MAINTAINERS index dcffe9fc54f6..2d4d19201aec 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -3423,6 +3423,7 @@ F: drivers/watchdog/gunyah_wdt.c F: include/dt-bindings/arm/qcom,ids.h F: include/dt-bindings/firmware/qcom,scm.h F: include/dt-bindings/soc/qcom* +F: include/dt-bindings/thermal/qcom,qmi-tmd.h F: include/linux/firmware/qcom F: include/linux/soc/qcom/ F: include/soc/qcom/ diff --git a/include/dt-bindings/thermal/qcom,qmi-tmd.h b/include/dt-bindings/thermal/qcom,qmi-tmd.hFilename must match compatible. There are no qcom,qmi-tmd or qcom,.*tmd or qcom,.*qmi compatibles. Which device is providing this ABI? PAS?
thanks for review. Yes, this belongs under PAS. Should i rename the file to pas?
Best regards, Krzysztof

