On 02/09/15 13:34, Eduardo Valentin wrote: > This change introduces a section in the Introduction Chapter to > list concepts used by the Thermal Framework. > > Signed-off-by: Eduardo Valentin <[email protected]> > --- > Documentation/DocBook/thermal.tmpl | 129 > ++++++++++++++++++++++++++++++++++++- > 1 file changed, 128 insertions(+), 1 deletion(-) > > diff --git a/Documentation/DocBook/thermal.tmpl > b/Documentation/DocBook/thermal.tmpl > index f8fb8a2..66efed3 100644 > --- a/Documentation/DocBook/thermal.tmpl > +++ b/Documentation/DocBook/thermal.tmpl > @@ -84,5 +84,132 @@ > devices. > </para> > > - </chapter> > + <sect1 id="glossary"> > + <title>Glossary</title> > + <para>The Linux Kernel Thermal Framework uses a > + specific terminology to represent the entities involved > + in thermal constrained environments. This section > + summaries the terminology as dictionary. These terms are
summarizes
> + in use within the present document and in the source
> + code of the Linux Kernel Thermal Framework.
> + </para>
> + <glossary>
> + <glossentry>
> + <glossterm>Thermal Zone</glossterm>
> + <glossdef>
> + <para>Thermal zones represent
> + what is the current status of a
> + thermal constrained zone in the
> + hardware. The zone usually is a
> + device or component. The status
> + of a thermal zone is mainly with
> + respect to temperature.
> + Currently, the Linux Kernel
> + Thermal Framework represents
> + temperature in miliCelsius. The
> + current abstraction covers for
> + non negative temperatures and
non-negative
> + constraints.
> + </para>
> + </glossdef>
> + </glossentry>
> + <glossentry>
> + <glossterm>Thermal Sensors</glossterm>
> + <glossdef>
> + <para>Thermal sensors provide
> + temperature sensing capabilities
> + on thermal zones. Typical
> + devices are I2C ADC converters
> + and bandgaps. These are nodes
> + providing temperature data to
> + thermal zones. Thermal sensor
> + devices may control one or more
> + internal sensors.
> + </para>
> + </glossdef>
> + </glossentry>
> + <glossentry>
> + <glossterm>Trips Points</glossterm>
Trip Points
> + <glossdef>
> + <para>The trip node describes a
> + point in the temperature domain
> + in which the system takes an
> + action. This item describes just
> + the point, not the action. Trip
> + points are represented as
> + temperature in miliCelsius. The
> + current abstraction covers for
> + non negative temperatures.
non-negative
> + </para>
> + </glossdef>
> + </glossentry>
> + <glossentry>
> + <glossterm>Thermal Governor</glossterm>
> + <glossdef>
> + <para>Thermal Governors
> + represent a policy to manage the
> + thermal zone device temperature.
> + The governor targets to keep
> + temperature in an acceptable
> + range which correlates to the
> + power budget, while maximizing
> + the performance. Governors can
> + be implemented in Kernel Space
> + or in User Space.
> + </para>
> + </glossdef>
> + </glossentry>
> + <glossentry>
> + <glossterm>Thermal Cooling
> Device</glossterm>
> + <glossdef>
> + <para>Cooling devices provide
> + control on power dissipation.
> + There are essentially two ways
> + to provide control on power
> + dissipation. First is by means
> + of regulating device
> + performance, which is known as
> + passive cooling. A typical
> + passive cooling is a CPU that
> + has dynamic voltage and
> + frequency scaling (DVFS), and
> + uses lower frequencies as
> + cooling states. Second is by
> + means of activating devices in
> + order to remove the dissipated
> + heat, which is known as active
> + cooling, e.g. regulating fan
> + speeds. In both cases, cooling
> + devices shall have a way to
> + determine the state of cooling
> + in which the device is.
> + </para>
> + </glossdef>
> + </glossentry>
> + <glossentry>
> + <glossterm>Cooling State</glossterm>
> + <glossdef>
> + <para>Any cooling device has a
> + range of cooling states (i.e.
> + different levels of heat
> + dissipation). For example a
> + fan's cooling states correspond
> + to the different fan speeds
> + possible. Cooling states are
> + referred to by single unsigned
> + integers, where larger numbers
> + mean greater heat dissipation.
> + The precise set of cooling
> + states associated with a device
> + (as referred to be the
> + cooling-min-state and
> + cooling-max-state properties)
> + should be defined in a
> + particular device's binding.
> + </para>
> + </glossdef>
> + </glossentry>
> + </glossary>
> + </sect1>
> + </chapter>
> </book>
>
--
~Randy
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