On Tue, Feb 10, 2015 at 02:50:36PM -0800, Randy Dunlap wrote: > On 02/09/15 13:34, Eduardo Valentin wrote: > > > + <chapter id="introduction"> > > + <title>Introduction</title> > > + <para>Thermal management is any method or technique implied to > > + mitigate emergencies caused by operating devices within > > + unsupported temperatures. The challenge consists of designing a > > I would flip the ending of that sentence: > caused by operating devices outside of > supported temperatures. > > > + product keeping the junction temperature of the IC components. > > + The operating temperature of IC components used on products must > > + operate within their design limits. Besides, temperature towards > > + device enclosure must be in a comfort level for the user. > > + Therefore, thermal management, by the time of this writing, > > + starts in very early device design phase. Managing thermal may > > + involve different disciplines, at different stages, such as > > + temperature monitoring, floorplanning, microarchitectural > > + techniques, compiler techniques, OS techniques, liquid cooling, > > + and thermal reliability or security. This document covers what > > + the Linux Kernel Thermal Framework provides as abstraction to > > + users with respect to thermal management. > > + </para> > > + <para>One of the first proposals to provide a solution to cover > > + the thermal problem appears in the Advanced Configuration and > > + Power Interface (ACPI) specification. ACPI provides an open > > + standard for device configuration and power management by the > > + operating system. However, several computing devices which may > > + have thermal issues in the market disregard the ACPI standard. > > + Therefore, the Linux Kernel Thermal Framework has been designed > > + to serve as abstraction for ACPI and non-ACPI systems. The core > > + concepts applies in both types of systems. > > + </para> > > + <para>The Linux Kernel Thermal Framework has a design which > > + represents the different thermal constraints found in an > > drop: an^^ > > > + end-products. The thermal constraints exist to serve different > > + purposes. There two major types of thermal constraints. The > > There are two > > > + first is related to components junction temperature. The second > > + is related to the level of comfort while end users are handling > > + devices. > > + </para> > > + > > + </chapter> > > +</book> > > > > > -- > ~Randy
Thanks Randy for checking this up. I apologize for forgetting Ccing you in my original post. I will fix the text as per your suggestions and also copy you in next version. Thanks for you time. Eduardo Valentin
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